JBC Soldering
SolderKing F3-15 Low Residue, No Clean Soldering Flux Pen
A very low solids (1.9%) halogen and resin free, alcohol based no clean soldering flux.
SK F3-15 is equally suited to wave and selective soldering operations for lead free and lead based soldering when post soldering cleaning is not required.
If cleaning is required, Solderking saponification cleaning agents can be used.
SK F3-15 is also offered as a re-work flux provided in nib-push re-work pens or supplied as bulk in bottles.
SK F3-15 leaves a minimum non-tacky or greasy residue and is recommended for no clean soldering when a J-STD 004 flux type ORL0 is considered acceptable for the assembly end use specification.
JBC Soldering
SolderKing F3-15 Low Residue, No Clean Soldering Flux Pen
A very low solids (1.9%) halogen and resin free, alcohol based no clean soldering flux.
SK F3-15 is equally suited to wave and selective soldering operations for lead free and lead based soldering when post soldering cleaning is not required.
If cleaning is required, Solderking saponification cleaning agents can be used.
SK F3-15 is also offered as a re-work flux provided in nib-push re-work pens or supplied as bulk in bottles.
SK F3-15 leaves a minimum non-tacky or greasy residue and is recommended for no clean soldering when a J-STD 004 flux type ORL0 is considered acceptable for the assembly end use specification.
JBC Soldering
SolderKing F3-15 Low Residue, No Clean Soldering Flux Pen
A very low solids (1.9%) halogen and resin free, alcohol based no clean soldering flux.
SK F3-15 is equally suited to wave and selective soldering operations for lead free and lead based soldering when post soldering cleaning is not required.
If cleaning is required, Solderking saponification cleaning agents can be used.
SK F3-15 is also offered as a re-work flux provided in nib-push re-work pens or supplied as bulk in bottles.
SK F3-15 leaves a minimum non-tacky or greasy residue and is recommended for no clean soldering when a J-STD 004 flux type ORL0 is considered acceptable for the assembly end use specification.